李满

发布者：webmaster发布时间：2024-12-23浏览次数：10


李满，中国科学技术大学热科学和能源工程系，特任教授、博士生导师，2023年获推荐国家高层次人才青年项目，获2023年国家优秀自费留学生奖B类。主要研究兴趣包括：微纳米传热测量与机理分析、极限热传导材料和器件开发、芯片热管理、动态热调控等，以第一作者（含共一）在Science, Nature Electronics，Advanced Materials等期刊发表了14篇研究论文，总计发表SCI论文30余篇；先后被包括科学美国人和 IEEE Access 等超过 26 家国际顶级媒体报道，并被选为2023 年半导体领域最受瞩目的十大新闻之一。


一、联系方式

单位：中国科学技术大学工程科学学院热科学和能源工程系

地址：安徽省合肥市黄山路443中国科大西区力学四楼331

邮编：230026

邮箱：manli90@ustc.edu.cn


二、个人经历

2008.09-2012.06    华中科技大学 热能与动力工程 学士

2016.09-2022.12    美国加州大学洛杉矶分校 机械工程系 博士

2023.02-2024.08    美国加州大学洛杉矶分校 机械工程系 博士后

2024.10至今           中国科学技术大学 热科学和能源工程系 特任教授


三、研究方向

微纳米传热测量与机理分析

极限热传导材料和器件开发

高功率芯片热管理

动态热调控技术


四、代表性论文

  1. M. Li, K. Pan, Y. Ge, K. Huynh, M. S. Goorsky, T. S. Fisher, Y. Hu, Wafer-scale bonded GaN–AlN with high interface thermal conductance. App. Phys. Lett. 125, 032104 (2024) *Featured by the APL editors

  2. Z. Qin, L. Dai, M. Li (co-first author), S. Li, H. Wu, K. E. White, G. Gani, P. S. Weiss, Y. Hu, Moiré Pattern Controlled Phonon Polarizer Based on Twisted Graphene. Adv. Mater. 35, 2312176 (2024)

  3. M. Li, H. Wu, E. M. Avery, Z. Qin, D. P. Goronzy, H. Nguyen, T. Liu, P. S. Weiss, Y. Hu. Electrically Gated Molecular Thermal Switch. Science, 382, 585-589 (2023) *Highlighted by Scientific American and selected as the Top 10 Semiconductor Stories of 2023 by IEEE Spectrum

  4. M. Li, L. Dai, Y. Hu, Machine Learning for Harnessing Thermal Energy: From Materials Discovery to System Optimization. ACS Energy Letters, 7, 3204-3226 (2022)

  5. S. Li, Z. Q, H. Wu, M. Li, M. Kunz, A. Alatas, A. Kavner, Y. Hu, Anomalous thermal transport under high pressure in boron arsenide. Nature, 612, 459-464 (2022) *Highlighted by Scientific American, National Science Foundation, and National Academy of Engineering

  6. J. S. Kang, M. Li (co-first author), H. Wu, H. Nguyen, Y. Hu, Integration of boron arsenide cooling substrates into gallium nitride devices. Nature Electronics. 4, 416–423 (2021) *Highlighted by a Perspective article in Nature Electronics

  7. Y. Cui, Z. Qin, H. Wu, M. Li, and Y. Hu, Self-assembled manufacturing for thermal management of wearable electronics and soft robotics, Nature Communications. 12, 1284 (2021)

  8. Y. Cui, M. Li (co-first author), Y. Hu, Emerging interface materials for electronics thermal management: Experiments, modeling, and new opportunities. J. Mater. Chem. C. 8, 10568 (2020).

  9. M. Li, J. S. Kang, H. D. Nguyen, H. Wu, T. Aoki, Y. Hu, Anisotropic Thermal Boundary Resistance across 2D Black Phosphorus: Experiment and Atomistic Modeling of Interfacial Energy Transport. Adv. Mater. 31, 1901021 (2019)

  10. M. Li, Z. Qin, Y. Cui, C. Yang, C. Deng, Y. Wang, J. S. Kang, H. Xia, Y. Hu, Ultralight and Flexible Monolithic Polymer Aerogel with Extraordinary Thermal Insulation by A Facile Ambient Process. Adv. Mater. Interfaces, 1900314 (2019).

  11. M. Li, J. S. Kang, Y. Hu, Anisotropic thermal conductivity measurement using a new Asymmetric-Beam Time-Domain Thermoreflectance (AB-TDTR) method. Rev. Sci. Instrum. 89, 084901 (2018).

  12. J. S. Kang, M. Li, H. Wu, H. Nguyen, Y. Hu, Experimental observation of high thermal conductivity in boron arsenide. Science. 361, 575–578 (2018). Highlighted by a Perspective article in Science